2021 International Conference on Mechatronics Engineering and Artificial Intelligence

Meeting Time

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December 17,2021 December 19,2021

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Submitted to these Indexers

EI、SCOPUS

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+86-13922151284

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About MEAI 2021

Important Dates

Submission Deadline: December 13,2021

Registration Deadline: Before December 17, 2021

Conference Date:  December 17-19, 2021

Notification:  1 week after the submission


As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. These endeavors have made new contribution to globalization and creating a community of shared future. To adapt to this changing world and China’s fast development in this new era, the 2021 International Conference on Mechatronics Engineering and Artificial Intelligence (MEAI2021) is to be held on December 17-19, 2021 in Dalian, China


The conference will focus on the themes of Mechatronic Systems, Intelligent Measurement and Control, Artificial Intelligence, Intelligent Manufacturing and Automation", aiming to provide a platform for The conference aims to provide a platform for research scholars, technicians and related personnel engaged in Mechatronics Engineering and Artificial Intelligence to share research results and cutting-edge technologies, understand academic trends, broaden research ideas, strengthen academic research and discussion, and promote industrial cooperation of academic results. Experts, scholars, business people and other related personnel from universities and research institutions at home and abroad are cordially invited to participate in the exchange.


We warmly invite you to participate in MEAI 2021 and look forward to seeing you in Dalian!


Publication

All submissions will be blind reviewed by the Committees on the basis of technical quality, relevance to conference topics of interest, originality, significance, and clarity. Accepted and selected papers will be recommended to be published in the Conference Proceedings, which could be submitted for indexing by Ei Compendex and Scopus Index

Sponsored by

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Venue